name: Mobile Phone Board
Layers: 6L HDI
Thickness: 1.0mm
Inner Min line width / distance: 0.1mm/0.1mm
Outer Min line width / distance: 0.08mm/0.1mm
Minimum laser hole: 0.1mm
Minimum hole diameter: 0.2mm
Impedance: 50 ohms, plus or minus 10% tolerance
Fork points Impedance: 100 ohms, plus or minus 10% tolerance
Minimum BGA solder joints: 0.23mm
Surface treatment: OSP + Immersion Gold

Being Technology provides all range of services dealing with PCB Designing, Engineering, Manufacturing and PCB assembly, and our Logistics skills support us to meet the most requirements and to deliver worldwide on time, on price. We also provide small to large production volumes, with both short run and weekly production capabilities.