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ABP ELECTRONICS LIMITED 30 Layers Double-sided PCB with Aluminum Base Material

ABP ELECTRONICS LIMITED

 
 
 

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30 Layers Double-sided PCB with Aluminum Base Material - Aug, 08 2012

Key Specifications/Special Features:

PCB technical capacity
Base materials: high temperature FR4/FR5, free halogen FR4, aluminum based, polyimide, rogers, arlon, and other teflon/PTFE
Layers: 1 to 30 layers standard PCB
Blind vias and buried vias board
Minimum track space: 4/4mil, 3mils partial allowed
Maximum dimensions: 1, 000 x 1, 200mm
Minimum dimensions: 3 x 3mm
Surface copper thickness:
Maximum: 6/6oz
Minimum: 0.5/0.5oz
Hard gold thickness: (maximum) 50u-inch
Maximum board thickness: 6.0mm
Finishes: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin, electroless, and nickel/immersion gold

Company Name : ABP ELECTRONICS LIMITED