Key Specifications/Special Features:

Base materials: high temperature FR4/FR5, free halogen FR4, aluminum based, polyimide, rogers, arlon and other teflon/PTFE
Layers: 1 to 30 layers standard PCB
Blind and buried vias board
Minimum track space: 4/4 mil and 3 mils partial allowed
Maximum size: 1, 000 x 1, 200mm
Minimum size: 3 x 3mm
Surface copper thickness:
Maximum: 6/6oz
Minimum: 0.5/0.5oz
Maximum board thickness: 6.0mm
Finishes: SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin and electroless nickel/immersion gold