OUR CAPACITY:

Layers and Type:1-30 layers standard PCB, Blind Vias and Buried Vias Board.
Minimum Track Space:4mil /4 mil, 3mils partial allowed;
Minimum Annular Ring:3 mils for via hole 6mils for component hole.
Board Thicknes:0.2mm-6.0mm
Technique: HAL, HASL (lead free), immersion gold, Immersion Tin, Plated Tin, Immersion Silver, OSP, Flux, flash gold
Copper thickness:0.5/0.5OZ-6/6OZ
Materials: Fr4, rogers, Teflon, high temperature, free halogen, aluminum-based, ISOLA.
Monthly Output:10, 000 to 19, 999 Square Meter