Applications:
Applicable to unsoldering varieties of components such as SOIC, CHIP, PLCC, QFP, BGA, etc. (especially applied to unsoldering cellphone flat cables and cable connectors)
For thermal contraction, drying, paint removal, viscosity elimination, thaw, warm-up, disinfection, welding, etc.
Weld gum component, ringer, socket, inline block without deformation, weld circuit board without blistering, unsolder shielding cover without discoloring, and weld BGA chip not easy to tear apart.

Technical Specifications:
Design Category: Antistatic
Power Consumption: 800W
Airflow Type: Soft wind without carbon brush
Gas Feed Rate: 120L/min (Max.)
Temperature Regulating Range: 100℃-450℃
Display Format: Digit display
Handle Length: 85cm
Noise: