Applications:
It is applicable to unsoldering varieties of components such as SOIC, CHIP, PLCC, QFP, BGA, etc.
For thermal contraction, drying, paint removal, viscosity elimination, thaw, warm-up, disinfection, welding, etc.
Weld gum component, ringer, socket, inline block without deformation, weld circuit board without blistering, unsolder shielding cover without discoloring, and weld BGA chip not easy to tear apart.

Technical Specifications:
Design Category: Antistatic
Power Consumption: 600W
Airflow Type: Soft wind without carbon brush
Gas Feed Rate: 120L/min (Max.)
Temperature Regulating Range: 100℃-450℃
Display Format: Digital LED Display
Handle Length: 85cm
Noise: