Applications:
Applicable to unsoldering varieties of components such as SOIC, CHIP, PLCC, QFP, BGA, etc.
For thermal contraction, drying, paint removal, viscosity elimination, thaw, warm-up, disinfection, welding, etc.
Weld gum component, ringer, socket, inline block without deformation, weld circuit board without blistering, unsolder shielding cover without discoloring, and weld BGA chip not easy to tear apart.

Technical Specifications:
Model: HUAKO 850A+
Design Category: Antistatic
Power Consumption: Standard：230W Max：600W
Air pump: Diaphragm Type
Gas Feed Rate:27L/min (Max)
Temperature Regulating Range:150℃-500℃
Display Format: Digital Display
Handle Length:120CM
Noise: