High Tg (> 170 oC)
Phenolic cured (Dicy Free) system with inorganic filler
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination)
Low Coefficient of Thermal Expansion (< 2.8% from 50 – 260oC)
High heat resistance demonstrated by T-260, T-288 and T-300
T-260 > 60 min.
T-288 > 20 min.
T-300 > 10 min.
Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float.
CAF 1000 hrs