Bonding machine for LCD Refurbishment
FOG/FOB bonding machines，
bonding equipment，
bonding machine，
FOB bonding machine，
bonder machine，
bonder equipment，


1. About the application field of FOG/FOB bonding equipment XCM71 - A5
FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as， television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises.

2.About the basic parameters of FOG/FOB bonding equipment XCM71 -A5
Input Power， AC220V 50-60Hz
Working pressure ，0.4-0 .8 Mpa
Operating modes， 7-inch HMI
Dimensions， L2210 × W1730 × H1500 mm
The method of Heating， heating or pulse heating thermostat
The quantity of Fixture， 2 group X-Y-θ micrometer adjustable
Range of Temperature ， RT-500
Control program， PLC controller
Body main material， Steel + baking varnish
The thermocouple， K type

3.About the functions and characteristics of the FOG/FOB bonding equipment XCM71 - A5
3.1use pneumatic components of Japan SMC and high-precision the moving parts
3.2 use temperature controller of Japan and The function module of the integral PID self-tuning temperature, accurate temperature.
3.3 Imported PLC control，the operation of 7-inch full-color touch-screen
3.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.