*Range of product: Monolayers, Bilayers, Multilayers, Flexibles, Rigid-flexibles, Teflon, High Tg materials.
*Surface Finishings: Chemical Ni, Au Electrolitical Ni, Au Hot Air Levelling Tin
*Lead Passivated Copper Chemical Tin Chemical Silver
*Final protections:Fotographic Solder, Serigraphic Solder, Fotographic Solder for flex Kapton, Component Silkscreen, Peelable. Kapton Cover Layer
*Worked Materials: FR4, BT, POLYMIDE, TEFLON.DUROID, 45 N, 85 N, T 200, T 200
KAPTON (elettroplated Cu), KAPTON (laminated Cu & epoxy adesive), MYLAR
*Final Protections: Fotographic Solder, Serigraphic Solder, Fotographic Solder for flex Kapton, Component Silkscreen, Peelable, Kapton Cover Layer
*Chanical Finisheding: Milling. Scoring, Punching, Punching for flex materials
Minimum hole :0.2 mm
Via hole type: Blind/Burried/plugged
Minimum conductor width :0.075 mm
Min. isolation between conductors :0.075 mm
Number of layers: 1-30
Board thickness : 0.2 - 5 mm
Copper thickness :17, 35, 70, 105, 150 m 175um
Max Board dimensions :800 x 508 mm
Color of solder mask: Green, Black, Blue, Red, White and so on
Pressfit
Blind and buried vias
Controlled impedence