HXF Series Hot Air Circulating Box Oven

Applications: Welding and drying of semiconductor and precision component in N2 atmosphere, de-binding of ceramic, curing of organic material, especial drying etc.
Features: Hot-air circulation, parallel flow, high heat efficiency, uniform temperature; energy saving.
Temperature Range: RT-150/350/550/750℃

Options:
Programmable temperature control, forced cooling system, temperature recording, computer monitoring system, cleanness design, atmosphere protection system, binder burning out system and double door design.

Notes: HengLi also manufactures custom designed furnaces.