shenzhen earlysun technology co,ltd

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shenzhen earlysun technology co,ltd

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		High-power LED Die Attach Solder Paste Mar, 24 2010 High-power LED Die Attach Solder Paste,High-power LED Die Attach Solder Paste,High-power LED Die Attach Solder Paste,High-power LED Die Attach Solder Paste,High-power LED Die Attach Solder Paste

		underfill Mar, 24 2010 Typical application 1,It is designed for use as a reworkable under fill resin for CSP(FBGA) or BGA. 2,Primarily used to improve shock resistance (drop&thermal test reliability) Typical performance High reliability Fast flow Snap-cure

		Solder ball Dec, 21 2009 Pure metal, High-ball rate , used in BGA chip package, usually used with flux.

		Syringes Solder Paste Dec, 21 2009 There have three used way for Solder paste: template printing, dispensing, pin transfer. In the three methods, the dispensing's automation and precision is the highest. It require high thixotropy and uniformity for this kind of solder paste. It need

		TCA Fluxs Dec, 21 2009 Halogen-Free, Organic matter, help welding, usually used in BGA, SMT and other maintenance

		High-Lead solder paste of Semiconductor Dec, 21 2009 High lead, high melting point alloys, lead content is more than 85%. Can meet the ROHS directive. Usually used in package of power semiconductor device , can Miscibility with Au,Cu,Ag,high residual impedance and good welding strength

		Halogen-Free and Lead-Free solder paste Dec, 21 2009 Halogen-Free, Good Weld ability, Bright spot. Can meet halogen-free electronics, electrical appliances assembly of high-reliability requirements of welding.

		Leaded Solder Paste Dec, 21 2009 Containing halogen, the most common alloy before the application of Lead-Free solder paste. Silver in the Sn-Pb alloy can improve the mobility effectively; improve the his to compatibility between the solder paste and pad; effective control of wel

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