underfill
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shenzhen earlysun technology co,ltd underfill

shenzhen earlysun technology co,ltd

 
 
 

shenzhen earlysun technology co,ltd  Products

underfill
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underfill - Mar, 24 2010


Typical application

1, It is designed for use as a reworkable under fill resin for CSP(FBGA) or BGA.

2, Primarily used to improve shock resistance (drop&thermal test reliability)

Typical performance

High reliability Fast flow Snap-cure

consistent dispense properties over many shifts Higher productivity Workability

Auto filleting Filling in 0.5 mil（0.013mm)gaps
Company Name : shenzhen earlysun technology co,ltd

 

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