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Mica-AVA (Far East) Industrial Ltd
 
 
 

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Copper Clad Laminate FR4 Copper Clad Laminate FR4 - Feb, 23 2007
High Tg (> 140 oC) Phenolic cured (Dicy Free) system High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible Lower Coefficient of Thermal Expansion (< 3.5% from 50 – 260oC) High heat resistance demonstrated by T-260, T-288 an
 
 
Copper Clad Laminate FR4 Copper Clad Laminate FR4 - Feb, 23 2007
High Tg (> 170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expans
 
 
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Company Name : Mica-AVA (Far East) Industrial Ltd


 
 

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