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Mica-AVA (Far East) Industrial Ltd
 
 
 

Products

Copper Clad Laminate FR4
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Copper Clad Laminate FR4 - Feb, 23 2007


High Tg (> 140 oC)
Phenolic cured (Dicy Free) system
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible
Lower Coefficient of Thermal Expansion (< 3.5% from 50 – 260oC)
High heat resistance demonstrated by T-260, T-288 and T-300
T-260 > 60 min.
T-288 > 15 min.
T-300 > 3 min.
Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float
CAF 1000 Hrs
 

Company Name : Mica-AVA (Far East) Industrial Ltd


 
 

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